Short descriptio
MECHANIC SYRINGE TIN NO LEADED PASTE WITH BISMUTH TO WELD WQ-80-BS458 40GRMechanic Syringe Tin No Leaded Paste With Bismuth To Weld Wq-80-Bs458 40grMECHANIC SYRINGE TIN NO LEADED PASTE WITH BISMUTH TO WELD WQ-80-BS458 40... Read more...
- Availability: In Stock 26
- 2 or more 6,05€
- 10 or more 5,81€
- 20 or more 5,69€
MECHANIC SYRINGE TIN NO LEADED PASTE WITH BISMUTH TO WELD WQ-80-BS458 40GR
Mechanic Syringe Tin No Leaded Paste With Bismuth To Weld Wq-80-Bs458 40gr
MECHANIC SYRINGE TIN NO LEADED PASTE WITH BISMUTH TO WELD WQ-80-BS458 40GR
Description:
- High performance, no cleaning solder paste
- Lead-free solder paste
- Composition Sn42Bi58
- Microns: 25-45um
- Capacity 40 grams
- Refrigerator storage
Differences between types of solder paste:
WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-140 º WQ86-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-140 º WQ86-140 º WQ86-140 º WQ86-140
XG-50 Sn63/Pb37 (10CC - 42GR) 185 -190º medium melting point
BST-705 sn99cu07ag03 235 - 240º high melting point
Every pasta and every composition is different:
WQ86 and 906sbl is used to desolder integrated SMD by some people mix it with existing to reduce the melting point of tin and be able to desolder by air more easily or with solder, but its normal use is in LED strips or things that can not be soldered at high temperatures.
XG-Z40 Sn63/Pb37 is the most used tin of all life, unfortunately to carry lead can not be used for the manufacture of products to be marketed because it is prohibited, but to repair or do things or plates for their own use.
BST-705 sn99cu07ag03 this is the default alloy used by all electronic boards today to comply with the ROHS standard, but its melting point is the same as the rest of the tin in the electronic board, so if it is not for a production of a product to be marketed, better use a tin with a lower melting point if only for a repair.
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