Estação Shuttle Star Sp360c V3

Estação Shuttle Star Sp360c V3

Shuttle Star RW-SP360C BGA Rework Station

Shuttle Star RW-SP360C BGA rework station produzir high-tem breeze, precisely controlling the soldering and desoldering process. With movable heating head, able to move horizontally; easy to operate. Embedded industrial computer, touch screen interface, PLC controle; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 inch high definition screen, convenient for operation and observation.

Shuttle Star RW-SP360C Features:

High quality heating produzir material high-tem breeze, precisely controlling the soldering and desoldering process.
Movable heating head, able to move horizontally; easy to operate;
Embedded industrial computer, PLC controle, real-time display profile, able to display set profile and practically-tested profile; big screen size, easy to operate
Profile saving no-limit this industrial computer can analyze the two practically-tested profiles, can we both English and Chinse
The temperatures of the upper and lower hot air heaters can be precisely controlled according to their specific temperatures. The infrared constant temperatura de aquecimento zone at the bottom area and the appropriate temperatire-controle settings make the rework safer and more reliable
The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage.
Powerful cross flow can cool the lower heating area;
Buzzer after soldering is finished or desoldering, hand vacuum is adjustable for removing BGA
The adjustable PCB positioning supports, onto which the special fixtures for alloyed board could be installed, enables easy and fast positioning of the PCB board
With different alloy hot gás nozzles, easy to replace. It could be tailored as per the specific requirement
The software can be updated to auto-profile in future by USB, não need to set profile.
The integrated design of machine and chassis is room-saving.

Shuttle Star RW-SP360C Specifications:
Suit for PCB 430x350 mm (max)
Suit for chip Max dimensão 55x55 mm
Mini dimensão 7 x 7 mm
Max weight 80g
Power for operation 400w
Main heater 800w
Lower heater 800w
Bottom heater 2400w
Dimensão 650x500x600 mm
Weight 36 kg
Power for requirement AC 220V, 4KW

Shuttle Star RW-SP360C BGA Rework Station
Package Contains:
1x RW-SP360C BGA Rework Station
5x Nozzles (44, 41, 38, 34, 31)
1x Tool Box
1x Hexagonal Wrench Set
1x Clipe
1x Brush
1x Suction Nozzle
1x Aluminum Plate
2x Aluminum Nozzles (big and small)
1x Temp. Wire
1x High-temperature Cloth
1x Manual