Solder paste leaded XG-40 (15GR)

Solder paste leaded XG-40 (15GR)

Solder Paste Leaded Xg-40 (15GR)

Solder paste leaded XG-40 (15GR)

Features:
- Solder paste with lead additive Sn63/Pb37
- Capacity 15 grams
- Particle Size: T3 (25-45 microns): 25-45um
 

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Differences between types of solder paste

WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-140 º WQ86-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-140 º WQ86-50GR-Sn42Bi58 -- very low melting point 138-140 º WQ86-140 º WQ86-140 º WQ86-140 º WQ86-140

XG-40 Sn63/Pb37 (10CC - 42GR) 185-190º medium melting point

BST-705 sn99cu07ag03 235 240º high melting point

Every pasta and every composition is different:

WQ86 is used to desolder integrated SMD by some people mix it with existing to reduce the melting point of tin and be able to desolder by air more easily or with solder, but its normal use is in led strips or things that can not be soldered at high temperatures.

XG-50 Sn63/Pb37 is the most used tin of all life, unfortunately to carry lead can not be used for the manufacture of products to be marketed because it is prohibited, but to repair or do things or plates for own use.

BST-705 sn99cu07ag03 this is the default alloy used by all electronic boards today to comply with the ROHS standard, but its melting point is the same as the rest of the tin in the electronic board, so if it is not for a production of a product to be marketed, better use a tin with a lower melting point if only for a repair.

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